Now Serving North America

Industry-leading post-etch punch systems engineered for multilayer PCB fabrication. Micron-level repeatability, in-line inspection, and 40+ years of field-proven technology — now with dedicated North American sales and service.

±0.0003"
Repeatability
9+
Panels / Min
40+
Years Innovation
Win 11
Platform

Product Lines

Three distinct platforms to address every post-etch punching requirement — from cost-effective production to HDI-grade precision.

Flagship Precision

ECP-4000 / ECP-8000

Enhanced Capability Punch — Flagship Series

The highest-precision platform. HDI and mil-spec grade with in-line coaxial inspection, 4/8 camera vision, bronze bushing die set, and ±0.0003" repeatability.

Repeatability
±0.0003"
Throughput
7–8 panels/min
Cameras
4 or 8
Inspection
Yes (ECP-8000)
View Specifications →
High Throughput

ATP-7800

8-Camera High-Throughput Platform

Engineered for high-volume fabricators. 9+ panels per minute with backward compatibility for legacy Optiline systems. A clear upgrade path for existing users.

Repeatability
±0.0005"
Throughput
9+ panels/min
Cameras
8 (4+4)
Max Panel
24" × 30"
View Specifications →
Cost-Effective

ATP-1000 / 3000E

4-Camera Automatic Post-Etch Punch

Fully automatic, cost-effective post-etch punching with 4-camera vision and 8+ panels/min throughput. Proven Multiline precision at an accessible price point.

Repeatability
±0.001"
Throughput
8+ panels/min
Cameras
4
Max Panel
24" × 28"
View Specifications →

Platform Comparison

Select the platform that best matches your production requirements, panel specifications, and integration needs.

Specification ECP-4000/8000 ATP-7800 ATP-1000/3000E
Punch Repeatability±0.0003"±0.0005"±0.001"
Tooling Accuracy±0.0005"±0.0008"
Vision Repeatability±0.00005"±0.00005"
Throughput7–8 panels/min9+ panels/min8+ panels/min
Camera System4 or 8 (4+4)8 (4 top + 4 bottom)4 (top)
Panel Size (max)24" × 30"24" × 30"24" × 28"
Extended Panel SizeUp to 25" × 49"Up to 25" × 49"Contact factory
Min Material Thickness0.001" (1 mil)*0.002" (2 mil)
Operating SystemWindows 11Windows 11Windows®
MES / SECS-GEMOptionalOptionalContact factory
Coaxial InspectionYes (ECP-8000)
Legacy Optiline Compat.Yes (2-cam mode)
Bronze Bushing Die SetAvailable
CertificationsCECECE
Best ForHDI, mil-spec, precisionHigh throughput, legacy upgradesCost-effective production

* ECP-RF configuration. ECP-8000 can achieve ±0.00015" repeatability for pin lamination applications.

Our Heritage

The original innovators of optical post-etch punching — now manufacturing the next generation.

Multiline Technology pioneered optical post-etch punching in 1983, establishing the industry standard for inner-layer registration in multilayer PCB fabrication. For decades, Multiline and Optiline systems were the benchmark equipment found in fabrication shops worldwide.

WKK represented Multiline across Asia for more than 30 years, building deep expertise in the technology and an extensive installed base. In December 2016, WKK acquired the global product rights to the entire Multiline Technology product line — including the ATP, OPE, and ECP series.

Today, WKK Machinery manufactures the next generation of Multiline systems from our advanced facility in Dongguan, China, incorporating modern Windows 11 platforms, SECS-GEM MES integration, and continuous precision improvements refined over four decades of engineering.

With the establishment of WKK America, we are bringing dedicated sales, service, and technical support to North American PCB fabricators for the first time.

40+
Years Innovation
±0.0003"
Repeatability
30+
Years WKK Partnership
2026
North America Launch
1983
Multiline Technology invents the optical post-etch punch — a new standard for inner-layer registration.
1980s–2010s
Hundreds of Multiline and Optiline systems installed across Asia, North America, and Europe.
Dec 2016
WKK acquires global product rights to the Multiline Technology product line after 30+ years of partnership.
2024–25
Next-generation ECP and ATP series launched with Windows 11, SECS-GEM, and enhanced precision capabilities.
2026
WKK America launches dedicated North American sales and service. Multiline is back.

Service & Support

Dedicated North American support built on decades of Multiline equipment expertise.

🔧

Field Service & Preventive Maintenance

Our North American service infrastructure provides on-site installation, commissioning, preventive maintenance, and emergency repair support. We are building a regional service network with experienced technicians who understand Multiline equipment inside and out.

📦

Parts & Consumables

Genuine Multiline replacement parts, punch and die components, and consumables available directly from WKK America. We are establishing domestic parts inventory to minimize lead times. Punch and die sharpening services are also available.

💻

Technical Support & Training

Remote diagnostics, operator training, and ongoing technical assistance. With direct access to the engineering team that designs and manufactures every Multiline system, we offer the depth of expertise only the original manufacturer can provide.

📋

Building a World-Class Service Organization

WKK America is actively investing in a comprehensive North American service and support infrastructure. We are finalizing partnerships with experienced service providers, establishing regional parts depots, and expanding our technical support team. Detailed service plans, warranty programs, and support packages will be announced in the coming months. Please contact us to discuss your specific support requirements — we are committed to ensuring every Multiline customer receives responsive, expert service.

Visit Us At

IPC APEX EXPO 2026

March 17–19, 2026  |  Anaheim Convention Center

Booth #4545

PCB Fabrication Section — Aisles 3800–4900

Contact Us

Whether you're evaluating equipment, need technical support, or want to schedule a meeting — we're here to help.

WKK America

📍

Headquarters

San Jose, California, USA

Email

info@multiline.com

Legacy Multiline / Optiline Users

Running legacy equipment? We support the full product family and can help with parts, service, upgrades, and migration to our latest generation systems.

ECP-4000 / ECP-8000

Enhanced Capability Punch • Flagship Precision Series

Our flagship product — functioning as both a precision post-etch punch and an in-line inspection machine. The ECP-8000 checks squareness and coaxial error between top and bottom panel sides during production. Customers report dramatically improved yield rates. Available in 4-camera (ECP-4000) and 8-camera (ECP-8000) configurations with ±0.0003" repeatability.

ECP-4000 / ECP-8000 Post-Etch Punch System

Technical Specifications

ParameterECP-4000 / ECP-8000
Punch Repeatability±0.0003" (±7.62 μm)
Positional Accuracy of Tooling±0.0005" (±12.7 μm)
Vision System Repeatability±0.00005" (±1.27 μm)
Image to Punch Accuracy±0.0005" (±12.7 μm)
ECP-8000 Throughput7 panels per minute
ECP-4000 Throughput8 panels per minute
Camera ConfigurationECP-4000: 4 (top)  |  ECP-8000: 8 (4 top + 4 bottom)
Panel Size (Standard)12" × 14" to 24" × 30"
Panel Size (Optional)Up to 25" × 49"
Min Material Thickness0.002" (2 mil); 0.001" with ECP-RF
Coaxial InspectionECP-8000 only
Operating SystemWindows 11
MES IntegrationSECS-GEM (optional)
Die Set ConstructionFour-post precision with bronze bushing system
Safety CertificationCE

ECP-8000 can achieve ±0.00015" repeatability for pin lamination applications.

Key Features

🔍

In-Line Inspection (ECP-8000)

Checks squareness and coaxial error between top and bottom panel sides during production — customers report dramatically improved yield rates.

BB

Bronze Bushing System

ECP-exclusive four-post die set with bronze bushing and pin system ensures mechanical repeatability unmatched by competitors.

4|8

Flexible Camera Configs

Choose ECP-4000 (4-camera, 8 panels/min) or ECP-8000 (8-camera, 7 panels/min with inspection) to match your requirements.

Ultra-Thin Material

Standard: down to 0.002" (2 mil). ECP-RF configuration handles materials to 0.001" (1 mil) at 4–5 panels/min for flex and rigid-flex.

MES

Factory Integration

Windows 11 platform with optional SECS-GEM MES integration, real-time SPC data collection, and English-language interface.

Easy Maintenance

Quick removal and replacement of punch/die modules for sharpening — designed for minimal production downtime.

Available Options

AP

Automatic Pre-Alignment

Fully automated operation without operator for hands-free production.

BB

Bronze Bushing System

ECP-exclusive high-precision die set for maximum mechanical repeatability.

MES

MES / SECS-GEM Integration

SEMI-standard factory automation interface for data collection and recipe management.

Extended Panel Size

Up to 25" × 49" for large-format applications.

RF

ECP-RF Configuration

Ultra-thin material handling down to 0.001" (1 mil) at 4–5 panels/min.

Custom Tooling

Custom punch and die configurations for specific production requirements.

Ideal For

HDI fabricators, mil-spec/aerospace shops, thin material specialists (flex/rigid-flex), and any operation where precision registration and quality verification are paramount.

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ATP-7800

8-Camera High-Throughput Post-Etch Punch System

Engineered for high-volume PCB fabricators who prioritize throughput without compromising accuracy. 9+ panels per minute with backward compatibility for legacy Optiline systems — a clear upgrade path for existing users.

ATP-7800 Post-Etch Punch System

Technical Specifications

ParameterATP-7800
Punch Repeatability±0.0005" (±12.7 μm)
Positional Accuracy of Tooling±0.0008" (±20.3 μm)
Vision System Repeatability±0.00005" (±1.27 μm)
Image to Punch Accuracy±0.0005" (±12.7 μm)
Throughput (2-camera)9+ panels per minute
Throughput (8-camera)7 panels per minute
Camera System8 cameras (4 top / 4 bottom)
Panel Size (Standard)12" × 14" to 24" × 30"
Panel Size (Optional)Up to 25" × 49"
Legacy CompatibilityYes — matches Multiline 2-camera target positions
Operating SystemWindows 11
MES IntegrationSECS-GEM (optional)
Die Set ConstructionFour-post precision die set
Safety CertificationCE

Tighter tolerances may be achievable for specific applications. Physical dimensions available upon request.

Key Features

8C

8-Camera Vision

4 top + 4 bottom cameras for comprehensive panel imaging, target acquisition, and deformation analysis.

Legacy Compatibility

Standard 2-camera Optiline PE mode enables seamless replacement of existing installations.

9+

Highest Throughput

9+ panels per minute in 2-camera mode — the fastest system in the Multiline product family.

<1

High Resolution Positioning

XYθ positioning with <1 μm resolution for micron-level accuracy.

RH

Remote Hydraulics

Hydraulic system located away from material platform, ensuring clean environment for sensitive PCB materials.

SPC

SPC Data Collection

Real-time statistical process control for trend analysis and process optimization.

Available Options

AP

Automatic Pre-Alignment

Fully automated operation without operator.

MES

MES / SECS-GEM Integration

SEMI-standard factory automation for data collection and recipe management.

Extended Panel Size

Up to 25" × 49" for large-format applications.

Custom Tooling

Multiple job-specific tooling configurations for rapid changeover.

Ideal For

High-volume fabricators, EMS companies, legacy Multiline/Optiline upgrades, and throughput-focused operations requiring 8-camera deformation analysis.

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ATP-1000 / 3000E

4-Camera Automatic Post-Etch Punch • Cost-Effective Production

A fully automatic, cost-effective post-etch punch built on Multiline's proven four-post die set platform trusted by PCB fabricators worldwide for over 30 years. Reliable production-rate punching with the precision tooling that defines the Multiline standard. Fully automatic operation at 8+ panels per minute with ±0.001" repeatability.

ATP-1000/3000E Post-Etch Punch System

Technical Specifications

Performance Specifications

ParameterATP-1000/3000E
Camera System4 cameras
Overall Repeatability±0.001" (±25.4 μm)
Throughput (4-camera)8+ panels per minute
Panel Size Range12" × 14" to 24" × 28"
Material Thickness0.002" to 0.062" (2–62 mil)
Tooling Configuration4 slots, 8 holes, 8 castings
Die Set ConstructionFour-post precision die set
Panel LoadingAutomatic
Panel AlignmentAutomatic
Panel UnloadingAutomatic
Operating SystemWindows® platform
Safety CertificationCE

Physical Specifications

DimensionValue
Length138" (3,505 mm)
Width99" (2,515 mm)
Height72" (1,829 mm)
Weight~7,170 lbs (~3,252 kg)
Compressed Air90 PSI (6.2 bar)

Ideal For

Mid-volume PCB fabricators, production environments requiring reliable automatic operation, shops expanding post-etch punch capacity, and fabricators seeking a cost-effective Multiline platform with proven precision tooling.

Key Features

Fully Automatic Operation

Automatic panel loading, alignment, punching, and unloading eliminates operator intervention and ensures consistent throughput across shifts.

4C

4-Camera Vision System

Four cameras provide comprehensive panel imaging for target acquisition and accurate registration across all supported panel sizes.

8+

8+ Panels per Minute

Production-rate punching that keeps pace with high-throughput inner layer lines while maintaining ±0.001" repeatability.

DB

Full-Size Die Block

Accommodates 4 slots, 8 holes, and 8 castings — the same proven tooling platform as premium Multiline systems.

2m

Thin Material Capability

Handles materials down to 0.002" (2 mil) core thickness for advanced multilayer constructions.

4P

Four-Post Die Set

Precision construction ensures perfect punch-to-die alignment over years of continuous production use.

Available Options

Extended Panel Size

Custom tooling layouts for non-standard panel sizes beyond 24" × 28".

MES

MES Integration

SECS-GEM compliance. Contact factory for availability.

Additional Tooling

Custom punch and die configurations for specific production requirements.

PT

Peripheral Tooling

Multi-tool and peripheral hole options for specialized applications.

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